FPC / Rigid-Flex (comasan)
PCB cruaidh (comasan)
FPC / Rigid-Flex (comasan)
| Cunntas sreathan | 1-28 sreathan |  |
| Laminates seòrsa | FR-4 (Tg àrd, Halogen an-asgaidh, tricead àrd) PTFE, BT, Getek, bunait alùmanum ， bunait copair ， KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Tiugh a ’bhùird | 6-240mil | |
| Cuideam copair Max Base | 210um (6oz) airson còmhdach a-staigh 210um (6oz) airson còmhdach a-muigh | |
| Min meud drile meacanaigeach | 0.2mm (0.008 ″) | |
| Co-mheas feart | 12: 1 | |
| Meud pannal Max | Taobh taobhan no taobhan dùbailte: 500mm * 1200mm, | |
| Sreathan multilayer: 508mm X 610mm (20 ″ X 24 ″) | ||
| Leud / àite as lugha loidhne | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Tro sheòrsa toll | Dall / Tiodhlaichte / Plugged (VOP, VIP…) | |
| HDI / Microvia | THA | |
| Crìoch uachdar | HASL | |
| HASL luaidhe an-asgaidh | ||
| Òr bogaidh (ENIG), Tun bogaidh, Airgead bogaidh | ||
| Glèidhidh Solderability Organic (OSP) / ENTEK | ||
| Flash Gold (plating òr cruaidh) | ||
| ENEPIG | ||
| Plating Gold Selective, Tiugh òir suas gu 3um (120u ”) | ||
| Meur òir, Clò-bhualadh Carbon, Peelable S / M. | ||
| Dath masg solder | Uaine, gorm, geal, dubh, soilleir, msaa. | |
| Impedance | Rian singilte, eadar-dhealachadh, bacadh coplanar fo smachd ± 10% | |
| Seòrsa crìochnachaidh geàrr-chunntas | Routadh CNC; V-sgòradh / gearradh; Punch | |
| Tolerances | Fulangas Min Hole (NPTH) ± 0.05mm | |
| Fulangas Min Hole (PTH) ± 0.075mm | ||
| Fulangas pàtran as ìsle ± 0.05mm |
PCB cruaidh (comasan)
| Deasaich | Nì | Comas |  |
|
| Cunntas sreathan | PCB cruaidh-flex | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Bòrd | Mion. Tiugh | 0.08 +/- 0.03mm | ||
| Max. Tiugh | 6mm | |||
| Max. Meud | 485mm * 1000mm | |||
| Toll & Slot | Min.Hole | 0.15mm | ||
| Toll Min.Slot | 0.6mm | |||
| Co-mheas Taobh | 10: 1 | |||
| Trace | Min.Width / Space | 0.05 / 0.05mm | ||
| Fulangas | Trace W / S. | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Toll gu toll | ± 0.075mm | |||
| Tomhas Toll | ± 0.075mm | |||
| Impedance | 0 ≤ Luach ≤ 50Ω: ± 5Ω 50Ω ≤ Luach: ± 10% Ω | |||
| Stuth | Sònrachadh Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Prìomh sholaraiche | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Sònrachadh Coverlay | PI: 2mil 1mil 0.5mil | |||
| Dath LPI | Uaine / Buidhe / Geal / Dubh / Gorm / Dearg | |||
| PI Stiffener | T: 25um ～ 250um | |||
| FR4 Stiffener | T: 100um ～ 2000um | |||
| SUS Stiffener | T: 100um ～ 400um | |||
| AL Stiffener | T: 100um ～ 1600um | |||
| Teip | 3M / Tesa / Nitto | |||
| Sgiath EMI | Fiolm airgid / Copar / inc airgid | |||
| Crìoch uachdar | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed an-asgaidh) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| A ’cur òr cruaidh | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Flash òr | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Airgead immesion | Ag: 0.1 - 0.3um | |||
| Tun plating | Sn: 5um - 35um | |||